Thermal CFD Analysis

Heat can degrade the performance and reliability of electronic devices. Power dissipation of ICs and power losses across the board are key inputs for thermal analysis. WiseAnalysis offers to take over a full system study of the thermal performance of electronic components, sub-systems and complete systems. 

We can perform thermal simulations to accurately predict the operating temperatures of electronic devices and adivse best cooling options (passive & active). We can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs, resulting in improved reliability and performance. 

 
CFD engineers that are part of the WiseAnalysis network have an extensive experience working with top base station OEMs on providing active cooling solutions for 4G and 5G radios.