Signed in as:
filler@godaddy.com
Signed in as:
filler@godaddy.com
Our EMC engineers use advanced 3D EM simulation tools to improve critical portions of the high-speed lane routing, such as vias, component, and connector areas. We use mainly SIWave from ANSYS. From the simulation, the designer gets information on impedances of the routing at different locations and S-param models showing the frequency response of the transmission path. S-param model allows tuning of equalization for the path when available. We also run lower frequency (<< 5GHz) analysis showing signal waveforms which are used to tune driver strengths and terminations. This is often the case with fast clock signals and memory interfaces (e.g. SC cards and DRAMs).
With power integrity analysis, power delivery network (PDN) performance is checked both for AC and DC. DC analysis ensures that enough DC power can be delivered without voltage drops and too high current densities improving also reliability. AC impedance of PDN is analyzed to meet specifications given for high performance and high current IC’s. The target is to secure power delivery at higher frequencies.
Our engineers are always challenged to tackle multi-level interference problems, especially in small form factor products such as handsets.
We examine potential EMI issues associated with an embedded phased array antenna on a DDR4 bus within a 5G smartphone (UE) phone which has beamforming capabilities s (in mmWave). For specific scan angles, the embedded antenna system can affect digital signals in the printed circuit board (PCB). For instance, noise generated by beamforming techniques at specific scan angles can degrade the signal integrity of the memory bus in the user equipment. Wiseanalysis offers all the expertise to help mitigating this type of complex problems.
Copyright © 2025 WiseAnalysis - All Rights Reserved.
Powered by WiseAnalysis Web Design